Xeon Platinum 8173M

Intel · Xeon Platinum · 2017 · LGA3647

Overview

The Intel Xeon Platinum 8173M is a server processor with 28 cores, released in 2017. It is part of the Xeon Platinum lineup, using the Xeon Scalable platform, and fits the LGA3647 socket. Internally, it is built on the "Skylake-SP" architecture. Thanks to Intel Hyper-Threading, each core can handle two instruction streams simultaneously, yielding a total of 56 threads for improved parallelism. The Xeon Platinum 8173M has a base clock of 2 GHz and can boost up to 3.5 GHz depending on workload and thermal headroom. Intel manufactures the "Skylake-SP" silicon on a 14nm process node. This processor supports DDR4 memory across 6 channels, up to 1.5TB total, with ECC support standard for data integrity in server workloads. It supports both single-socket (1P) and dual-socket (2P) configurations, with 48 lanes of PCIe 3.0 available for storage, networking and accelerators. With a TDP of 165W, the Xeon Platinum 8173M runs hot and requires a capable cooling setup. The cache hierarchy consists of 64KB/core of L1, 1MB/core of L2, and 38.5MB of L3 cache.

1st-generation Xeon Scalable (Skylake-SP) Platinum part with 28 cores at 2.0GHz base / 3.5GHz turbo and 38.5MB L3 in a 165W envelope, launched 2017. Platinum is the top tier, scaling to eight-socket systems over three UPI links with two AVX-512 FMA units per core. The M suffix raises supported memory to 1.5TB per socket, double the 768GB of standard parts, for large in-memory workloads.

Specifications

BrandIntel
FamilyXeon Platinum
SeriesXeon Scalable
ArchitectureSkylake-SP
CodenameSkylake-SP
Launch year2017
Cores28
Threads56
Base clock2 GHz
Boost clock3.5 GHz
L1 cache64KB/core
L2 cache1MB/core
L3 cache38.5MB
TDP165W
SocketLGA3647
Process14nm
Memory typeDDR4
Memory channels6
Max memory1.5TB
PCIe lanes48 (PCIe 3.0)
ECC memoryYes
Socket scalability1P and 2P
OEM / tray part numberCD8067303172400

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