AMD · Ryzen AI Max+ · 2026 · FP11
The AMD Ryzen AI Max+ 392 is a mobile (laptop) processor with 12 cores, released in 2026. It is part of the Ryzen AI Max+ lineup, using the Ryzen AI Max platform, and uses the FP11 package, which is soldered to the laptop's motherboard rather than socketed. Internally, it is built on the "Strix Halo" architecture. Thanks to AMD Simultaneous Multi-Threading (SMT), each core can handle two instruction streams simultaneously, yielding a total of 24 threads for improved parallelism. The Ryzen AI Max+ 392 has a base clock of 3.2 GHz and can boost up to 5 GHz depending on workload and thermal headroom. AMD manufactures the "Strix Halo" silicon on a 4 nm process node. This processor supports LPDDR5X memory. With a base TDP of 55W and a configurable TDP of 45–120W, which the laptop maker sets to suit its cooling design, the Ryzen AI Max+ 392 is a higher power envelope aimed at performance, gaming and workstation laptops. Integrated graphics are provided by the Radeon 8060S Graphics solution, so a discrete GPU is not required for display output. It also includes a dedicated NPU rated at 50 TOPS for on-device AI workloads. The cache hierarchy includes 12MB of L2 and 64MB of L3 cache.
| Brand | AMD |
|---|---|
| Family | Ryzen AI Max+ |
| Series | Ryzen AI Max |
| Architecture | Strix Halo |
| Type | Mobile |
| Launch year | 2026 |
| Cores | 12 |
| Threads | 24 |
| Base clock | 3.2 GHz |
| Boost clock | 5 GHz |
| L2 cache | 12MB |
| L3 cache | 64MB |
| Base TDP | 55W |
| Configurable TDP (cTDP) | 45–120W |
| Package | FP11 |
| Process | 4 nm |
| Memory type | LPDDR5X |
| Integrated graphics | Radeon 8060S Graphics |
| NPU | 50 TOPS |
| OEM / tray part number | 100-000001979 |