AMD · Ryzen AI 9 · 2026 · FP8
The AMD Ryzen AI 9 HX PRO 475 is a mobile (laptop) processor with 12 cores, released in 2026. It is part of the Ryzen AI 9 lineup, using the Ryzen AI 400 platform, and uses the FP8 package, which is soldered to the laptop's motherboard rather than socketed. Internally, it is built on the "Gorgon Point" architecture. Thanks to AMD Simultaneous Multi-Threading (SMT), each core can handle two instruction streams simultaneously, yielding a total of 24 threads for improved parallelism. The Ryzen AI 9 HX PRO 475 has a base clock of 2 GHz and can boost up to 5.2 GHz depending on workload and thermal headroom. AMD manufactures the "Gorgon Point" silicon on a 4 nm process node. This processor supports DDR5/LPDDR5X memory. With a base TDP of 28W and a configurable TDP of 15–54W, which the laptop maker sets to suit its cooling design, the Ryzen AI 9 HX PRO 475 is a balanced power envelope suited to mainstream laptops. Integrated graphics are provided by the Radeon 890M solution, so a discrete GPU is not required for display output. It also includes a dedicated NPU rated at 60 TOPS for on-device AI workloads. The cache hierarchy includes 12MB of L2 and 24MB of L3 cache.
| Brand | AMD |
|---|---|
| Family | Ryzen AI 9 |
| Series | Ryzen AI 400 |
| Architecture | Gorgon Point |
| Type | Mobile |
| Launch year | 2026 |
| Cores | 12 |
| Threads | 24 |
| Base clock | 2 GHz |
| Boost clock | 5.2 GHz |
| L2 cache | 12MB |
| L3 cache | 24MB |
| Base TDP | 28W |
| Configurable TDP (cTDP) | 15–54W |
| Package | FP8 |
| Process | 4 nm |
| Memory type | DDR5/LPDDR5X |
| Integrated graphics | Radeon 890M |
| NPU | 60 TOPS |
| OEM / tray part number | 100-000001860 |